Soft,lightly tacky thermal putty that levels mixed heights and stays in place; ideallayer thickness ~1–2 mm for tight, thin heat sinks; targets GDDR6 VRAMs, hotVRM stages, display/I/O controller chips; easy for beginners to apply.
UPSIREN U6 PRO 10g is engineered fordevices that drive high power through very compact cooling hardware. It forms aconformable bridge between components and thin heat sinks, deliveringdependable heat transfer where traditional soft pads struggle—common in moderngaming laptops and slim console revisions. With 12.8 W/m·K* thermalconductivity, it focuses on notorious hot spots such as GDDR6 VRAMs, powerstages, and controller ASICs, while remaining electrically nonconductive.
Packaging advantage – 10 g jar: a compact,resealable size that travels well in a toolkit, keeps benches tidy, andminimizes leftover material while still covering several memory/VRM zonesacross a typical laptop or compact board.
The texture is soft and just sticky enoughto stay where you place it, yet it spreads smoothly to even out small heightdifferences. Even amateur users can achieve neat, uniform layers: apply a thinfilm, build to ~1–2 mm total thickness, and confirm a gentle imprint afterreassembly. UPSIREN U6 PRO is produced in Thessaloniki, Greece (EuropeanUnion). The formulation was developed through scientific research cofunded byGreece and the European Union.
Packet includes:
• 1 × 10 g jar of UPSIREN U6 PRO thermal putty
• 1 × plastic spatula
• 2 × protective finger sleeves
*Computer Systems Materials ScienceLaboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N.Karagiannis; MSAIJ, 2014).
•Purpose built for thin form factor cooling: wicks into micro gaps and holdsshape under clamp pressure, helping low profile heat sinks move heat away fromGDDR6 VRAMs, VRM stages and controller chips without relying on a perfect padthickness.
• Packaging advantage – 10 g jar: pocketable supply for single devices or shortruns; reseals cleanly between steps and reduces waste while still servicingmultiple components on a laptop mainboard.
• Soft, lightly tacky consistency that is easy to place and adjust; adheresgently so the layer doesn’t skid during assembly, yet is smooth enough tofeather edges and avoid spillover on dense boards.
• Ideal thickness around 1–2 mm provides a stable interface across mixedcomponent heights, a practical fix when stock pads are slightly short, stiff,or leave corners uncovered.
• Electrically nonconductive with 12.8 W/m·K* thermal conductivity and broadoperating stability—suited to extended gaming sessions and productivity loadswith frequent temperature swings.
• UPSIREN U6 PRO is compatible with gaming laptops including Acer Nitro, ASUSROG Zephyrus G14, MSI GS66 Stealth, Lenovo Legion, and Dell G15, as well asother compact devices using thin heat sinks.
