Soft, lightly tacky compound optimized for~1–2 mm layers on GDDR6 VRAMs, VRM stages and controller chips; designed forgaming laptops and compact systems; easy, clean application for all skilllevels.

Packaging advantage – 100 g jar: bulk valuewithout compromising handling; decant small portions for microscope work, keepthe main jar sealed to preserve texture, and reduce reorders on long projects.

The compound is soft and just sticky enoughto stay put, yet smooth enough to spread evenly and level out minor heightdifferences. Even amateur users can achieve clean, uniform interfaces byapplying a thin film and building to ~1–2 mm total thickness before reassembly.UPSIREN U6 PRO is produced in Thessaloniki, Greece (European Union). Theformulation was developed through scientific research co-funded by Greece andthe European Union.

Packet includes:
• 1 × 100 g jar of UPSIREN U6 PRO thermal putty
• 1 × plastic spatula
• 2 × protective finger sleeves

*Computer Systems Materials ScienceLaboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N.Karagiannis; MSAIJ, 2014).

Bullets:
• Designed for thin form factor cooling: conforms to microgaps and resistsslump to enhance contact over GDDR6 VRAMs, VRM stages and other hot controllersin compact layouts.
• Packaging advantage – 100 g jar: high capacity supply for labs andrefurbishers; decant working amounts to maintain cleanliness and consistencyacross long, multidevice projects.
• Soft, lightly tacky body that stays put during assembly yet feathers cleanly;enables tidy edges and reliable reassembly on dense boards.
• Ideal performance at ~1–2 mm total thickness, evening out mixed heights wherestandard pads are short, stiff, or inconsistent.
• nonconductive with 12.8 W/m·K* thermal conductivity and wide operatingstability, supporting frequent thermal cycling in portable and compact systems.
• UPSIREN U6 PRO is compatible with gaming laptops, including Acer Nitro, ASUSROG Zephyrus G14, MSI GS66 Stealth, Lenovo Legion, and Dell G15, along withother thin heat sink platforms.

Tags: thermal putty; bulk jar; thin heatsinks; nonconductive
Keywords: UPSIREN U6 PRO, thermal putty, bulk jar, 12.8 W/m·K*, thin heat sink,laptop cooling, compact system cooling, GDDR6 VRAM, VRM stages, controllerchips, 1–2 mm layer, soft tacky texture, beginner friendly, refurbishing,production bench, decanting, Thessaloniki Greece, EU made, research funded, 100g jar