Thermalright Extreme Odyssey II Thermal Pad

🔥 14.8W/mK High-Performance Thermal Conductivity

Key FeaturesHigh Thermal Conductivity

Rated at 14.8W/mK for efficient heat transfer from integrated chips and graphics card memory.

Multiple Thickness Options

Available in 0.5mm to 4.0mm thicknesses, all sized 85x45mm to fit various gap requirements.

Safe Electrical Insulation

Breakdown voltage of 9.8kV (1mm) ensures safe use without electrical conductivity risk.

Versatile Application

Ideal for GPU VRAM, integrated chips, and other chipsets needing reliable thermal transfer.

Choosing Your Option

This listing includes 7 thickness variations (0.5mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm), all at the same 85x45mm pad size. Each variation is a single thermal pad of the selected thickness. Please choose the thickness that matches your component's gap for the best thermal Odyssey IIThermal Conductivity14.8 W/mKDimensions85 x 45mmThickness Options0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 4.0mmDensity3.1 ± 0.2 g/ccHardness30-55 ScBreakdown Voltage9.8kV (1mm)Electrical ImagesFAQQ: Does this conduct electricity?

A: No, this thermal pad is electrically non-conductive with a breakdown voltage of 9.8kV at 1mm thickness.

Q: What thickness should I choose?

A: Measure the gap between your component and heatsink/backplate, then select the closest matching thickness from the available options.

Q: Can this be used on GPU memory chips?

A: Yes, this pad is well suited for GPU VRAM, integrated chips, and other chipset cooling applications.