Thermal Grizzly minus pad 8

Thermal Grizzly's Minus Pad series features highly elastic and flexible thermal pads with exceptional conductivity that fill even the smallest gaps between components, made from a ceramic silicon formula complex and nano aluminum oxide for optimal and constant heat transfer with minimal pressure.

Technical Details

The Thermal Grizzly Minus Pad has a thermal conductivity of 8.0 W/mk and a temperature range of -100 °C to +250 °C. It is perfect for configurations that support extremely demanding applications. Simultaneously protects the contact surfaces and prevents the formation of microcracks.

The Thermal Grizzly Minus Pad 8 is best suited for electrical components such as PCs, notebooks, LED or LCD devices, semiconductors or transformers. For OC in particular, it is also used for CPUs, memory modules, GPUs, graphics card memories or motherboard chipsets. In general, it can be used for any component that uses a metal case as a heat sink.

Compatibilities

• PS3, PS4, PS5
• Xbox 360, One, Series S, Series X
• CPU, GPU
• motherboard chipset
• memory modules
• Any other component that uses a metal housing as a heat sink

• Thermal Conductivity:8 W/mk
• Thermal Resistance:0.625 K/W
• Thickness:3.0mm
• Measurement: 120mm x 20mm x 3.0mm
• Temperature Range:-100 °C to +250 °C
• Isulating:Yes

Minus Pad 8 is available in different sizes

• 30x30mm
• 120x20mm
• 100x100mm

with thickness options of 0.5mm, 1.0mm, 1.5mm, 2.0mm and 3.0mm.

General information

• Thermal Grizzly Minus Pad is a thermally conductive pad with insulating properties and removable adhesive, used as a soft gap filler that requires minimal pressure, made of modified silicone with metal oxides.
• Storage:Store Thermal Grizzly minus pad 8 at room temperature in its original packaging.

Scope of delivery

minus pad 8

minus pad 8 - 120mm x 20mm x 3.0mm

Bag

An airtight sealable and reusable package