High performance phase change pad (meltsnear 45 °C) that wets surfaces, fills micro gaps, and resolidifies for stablecontact; electrically nonconductive; ideal with modern GDDR6 VRAM, chipsets,and compact heat spreaders.

Why 40×40×0.25 mm is the sweet spot: The40 mm square spans the active contact zone of most CPU/GPU heat spreaders whileremaining easy to trim for smaller dies, so coverage is complete withoutoverhang. The 0.25 mm thickness keeps the bond line thin—lowering thermalresistance (Rth ≈ t / kA)—yet provides enough compliance to absorb typicalflatness and height variations. Under clamp load PTM7950® by CSGR softens nearits phase-change temperature and flows to wet the microscopic asperities ofboth surfaces, expelling trapped air; on cooldown, it resolidifies to lock inuniform pressure. Full performance is typically reached after a few thermalcycles—normal heatup under load and cooldown to ambient—over the first coupleof days, as repeated cycles continue to collapse micro voids and settle thematerial to a stable, high-contact bond line.

Packet includes:
• 1 × PTM7950 by CSGR® sheet, 40×40×0.25 mm (protective films on both sides)
• 1 × resealable storage envelope

*Computer Systems Materials ScienceLaboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N.Karagiannis; MSAIJ, 2014).

Bullets:
• Phase-change performance: softens around 45 °C to flow and wet interfaces,then resolidifies on cooldown to lock in a thin, uniform bond line that lowersthermal resistance during repeated on/off cycles.
• 8.5 W/m·K* conductivity in a non-electrically conductive formulation—safenear exposed pads and vias—supporting stable temps on CPUs/GPUs, VRAM heatspreaders, PCH/SoC packages, and compact vapor chamber lids.
• Sized 40×40×0.25 mm for broad coverage; can be trimmed to shape with scissorsor a craft knife for chiplets, laptop dies, or console APU footprints withoutfraying or crumbling.
• Durable under heat: tested for high temperature tolerance and repeatedthermal cycling, helping maintain contact quality through years of gaming,rendering, or workstation loads.
• Synergy with our putties: combine PTM7950 by CSGR® on the die/flat interfaceand K5 PRO/U6 PRO/UX PRO Ultra on surrounding components with larger gaps tocreate a complete, uniform thermal path.
• PTM7950 by CSGR® is compatible with PlayStation 5, Xbox Series X, NVIDIAGeForce RTX 3080/3090/4080/4090, AMD Radeon RX 6800/6900/7900 series, andperformance laptops from ASUS ROG, MSI, Acer Nitro, Lenovo Legion, and DellGSeries.

Tags: phase change pad; nonconductive;CPU/GPU cooling; high performance

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