itempropHalnziye HY206 Thermal Putty

High-Performance Gap Filler for CPU, GPU & VRAM Cooling

🧊 Product Overview

The Halnziye HY206 is a soft, moldable thermal putty designed to replace traditional thermal pads. It conforms to uneven surfaces for superior contact between chips and heatsinks, making it ideal for laptops, graphics cards, VRAM modules and other tight cooling applications.

⭐ Key Features🔥 6.0 W/m-K Conductivity

Efficiently transfers heat away from sensitive components to reduce thermal throttling.

🧩 Soft Gap Filling

Flexible putty easily fills irregular gaps between chip and heatsink for better contact.

🌡 Wide Temperature Range

Stable performance from -50°C to 200°C across demanding environments.

💻 Universal Application

Suitable for CPUs, GPUs, VRAM, laptops and graphics card heatsinks.

📦 Package Contents

1 x Halnziye HY206 Thermal Putty (100g container)

🎨 Choosing Your Option

All color variations (White, Blue, Pink, Black, Green) contain the same 100g quantity of HY206 thermal putty. The color is purely cosmetic and does not affect thermal performance.

🔧 PadMaterialRubber-based CompoundThermal Conductivity6.0 W/m-KNet Weight100gOperating Temperature-50°C to 200°CApplicationCPU, GPU, VRAM CoolingSuitable ForLaptop, Graphics Card, HeatsinkOriginMainland China🖼️ Product Images❓ FAQIs this a thermal paste or a pad replacement?

It's a soft putty that fills gaps like a thermal pad but spreads like a paste, combining the benefits of both.

Does the color affect performance?

No, all colors use the same 6.0 W/m-K formula; color is only for visual identification.

What devices can I use this on?

CPUs, GPUs, VRAM modules, laptops and other heat-generating electronics needing gap-filling thermal transfer.