The 5 High-Density Polysynthetic Silver Thermal Compound Enhances The Compound\'S Performance And Long-Term Stability. 5 Uses Three Unique Shapes And Sizes Of Pure Silver Particles To Maximize Particle-To-Particle Contact Area And Thermal Transfer. 5 Will Not Separate, Run, Migrate Or Bleed.
Thermally enhanced ceramic particles
3 unique shapes and sizes of pure silver particles
Ensures best physical contact between the heatsink and CPU core
Will not separate, run, migrate or bleed
3.5g
99.9% pure micronized silver
Will not separate, run, migrate or bleed
Thermal conductance: >350 000W/m2 degreesC (0.001 inch layer)
Easy to apply and remove