TP-4, 100 x 100 x 0.5 mm
HIGH-PERFORMANCE THERMAL CONDUCTIVITY WITH TP-4:Ultra-soft silicone-based pad outperforms many high-end alternatives, ensuring excellent heat transfer even across uneven chip surfaces.
OPTIMAL COMPRESSION FOR LOWER THERMAL RESISTANCE:Highly compressible material (e.g. 0.5 mm to 0.3 mm) minimizes thermal resistance and compensates height differences up to 40%.
PERFECT GAP FILLING PERFORMANCE:Adapts seamlessly to uneven surfaces and air gaps, providing reliable contact without stressing sensitive components.
VERSATILE APPLICATION ACROSS DEVICES:Ideal for RAM, GPUs, laptops, consoles, M.2 SSDs, and various electronic components requiring efficient thermal management.
SAFE AND USER-FRIENDLY DESIGN:Electrically insulating, non-adhesive, and vibration-dampening for secure handling and long-term reliability.
FLEXIBLE, CUT-TO-SIZE AND STACKABLE:Available in multiple sizes and thicknesses, easy to customize and stack without compromising thermal performance.
High Performance — Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.
Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.
High Performance — Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.
Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.
Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.
Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.
Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.
Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.
Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.
Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.
Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
Versatile Applications
Ideal for RAM, chipsets, GPUs, consoles, laptops, and many other electronic components. Flexible, vibration-dampening, and easy to cut.
